Sustainable and scalable alternative to lithography and wire bonding for interconnects

Fonontech is a semiconductor printing company that focuses on miniaturization of electrical bonding for a.o. microLED and 3D chips. Fonontech’s proprietary dispensing equipment is important to cost-effectively manufacture the next generation of 2.5D or 3D chip (IC) designs as well as for microLED assembly. Fonontech is a spin-out from Dutch applied research institute TNO, based on years of research on the impulse printing principle.